焦磷酸钾主要用于无氰电镀，代替氰化钠作为电镀的络合剂。也用于制备漂白、染色中的清洗剂、去污剂和除铁剂。混合物、组织改良剂等焦磷酸钾中所含的磷、钾等元素是植物生长的营养元素，是一种对农田土壤环境友好的物质。
Potassium pyrophosphate is mainly used in cyanide free electroplating, replacing sodium cyanide as the complexing agent of electroplating. It is also used to prepare detergent, detergent and iron remover in bleaching and dyeing. Phosphorus, potassium and other elements contained in potassium pyrophosphate, such as mixtures and tissue modifiers, are nutrient elements for plant growth and are friendly to farmland soil environment.
焦磷酸钾已被评估为安全的食品添加剂，允许焦磷酸钾在非标准化食品中用作乳化剂、胶凝剂、稳定剂、增稠剂、pH调节剂、酸反应材料和水校正剂和螯合剂混合物。
Potassium pyrophosphate has been evaluated as a safe food additive, allowing potassium pyrophosphate to be used as emulsifier, gelling agent, stabilizer, thickener, pH regulator, acid reaction material and mixture of water corrector and chelator in non standardized food.
焦磷酸钾是一种对农田土壤环境友好的物质。相关人员通过分批振荡淋洗实验研究了制备的焦磷酸钾淋洗液对模拟污染土壤中重金属铜的淋洗特性，并讨论了淋洗时间、淋洗液pH值和焦磷酸钾浓度对淋洗的影响。此外，还讨论了焦磷酸钾洗脱液作用下土壤中铜的解吸动力学以及洗脱前后重金属的形态变化。
Potassium pyrophosphate is a kind of material friendly to farmland soil environment. Relevant personnel studied the leaching characteristics of the prepared potassium pyrophosphate leaching solution on the heavy metal copper in simulated polluted soil through batch oscillation leaching experiments, and discussed the effects of leaching time, pH value of the leaching solution and potassium pyrophosphate concentration on leaching. In addition, the desorption kinetics of copper in soil under the action of potassium pyrophosphate eluent and the morphological changes of heavy metals before and after elution were also discussed.
结果表明，浸出时间越长，淋洗液浓度越大，浸出效果越好。对实验条件进行了优化，浸出和浸出24小时，洗脱液pH为7.0，n（焦磷酸钾）：n（铜）的比例为7：1。浸出效果好，铜浸出率为40.51%。焦磷酸钾洗脱的铜主要以酸萃取和还原形式存在。焦磷酸钾淋洗液对土壤铜的淋溶过程符合双常数方程，说明焦磷酸钾淋洗液作用下土壤中铜的解吸是一个非均相扩散过程。
The results show that the longer the leaching time is, the greater the concentration of eluent is, and the better the leaching effect is. The experimental conditions were optimized, leaching and leaching for 24 hours, the pH of the eluent was 7.0, and the ratio of n (potassium pyrophosphate): n (copper) was 7:1. The leaching effect is good, and the copper leaching rate is 40.51%. Copper eluted by potassium pyrophosphate mainly exists in the form of acid extraction and reduction. The leaching process of potassium pyrophosphate leaching solution on soil copper conforms to the two constant equation, which indicates that the desorption of copper in soil under the action of potassium pyrophosphate leaching solution is a heterogeneous diffusion process.

此外，氢氧化钾厂家经过调查发现，一些研究人员应用线性扫描伏安法和计时电位法分别测量并绘制了阴极极化曲线和恒电流电位-时间曲线，研究了焦磷酸铜在铜电极上的电化学行为。结果表明，焦磷酸盐镀液的成分、pH值和温度会影响铜电极电镀过程的阴极极化和恒电流电位。
In addition, the investigation of potassium hydroxide manufacturers found that some researchers used linear sweep voltammetry and chronopotentiometry to measure and draw the cathodic polarization curve and constant current potential time curve respectively, and studied the electrochemical behavior of copper pyrophosphate on the copper electrode. The results show that the composition, pH value and temperature of pyrophosphate plating solution will affect the cathodic polarization and constant current potential of copper electrode electroplating process.
镀液中，焦磷酸与Cu2质量比为8:1时，Cu2浓度为0.28-0.39mol/L，镀液pH为8.8-9.3，镀液温度为45-48℃，有利于获得结晶质量较好的镀铜层。
In the plating solution, when the mass ratio of pyrophosphoric acid to Cu2 is 8:1, the concentration of Cu2 is 0.28-0.39mol/l, the pH of the plating solution is 8.8-9.3, and the temperature of the plating solution is 45-48 ℃, which is conducive to obtaining a copper plating layer with good crystal quality.
阴极极化越大，恒电流电位越负，相应的镀液越容易获得致密的金属镀层，这与赫尔电池的实验效果一致。阴极极化曲线和恒电流电位-时间曲线可用于快速评价电镀级焦磷酸钾的质量。
The greater the cathodic polarization is, the more negative the constant current potential is, the easier it is to obtain a dense metal coating in the corresponding plating solution, which is consistent with the experimental effect of hull battery. Cathodic polarization curve and constant current potential time curve can be used to quickly evaluate the quality of electroplating grade potassium pyrophosphate.
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